Профессиональный производитель упаковочных подложек BGA.

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What is Ceramic Packaging Substrate?

2023-12-22 Новости компании / Новости / Уведомление / Новости торговли

Ceramic Packaging Substrate Manufacturing, Not only to use BT base, ABF base, Rogers Base, High TG FR4 base, we also can use the Ceramic base materials to build the Packaging Substrate. Как: 96 L2O3 Ceramic Substrates, ALN Ceramic Substrates. and other types Ceramic base materials. Ceramic packaging substrates, as…

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What is Semiconductor Substrate?

2023-12-21 Новости компании / Новости / Уведомление / Новости торговли

Semiconductor Substrate Vendor . the Package Substrate will be made with BT base, Showa Denko and Ajinomoto High speed base materials.and other high speed materials. A semiconductor substrate, commonly known as a semiconductor substrate, stands as a foundational element in the realm of printed circuit board (Печатная плата) engineering, providing a…

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What is BGA Substrate?

2023-12-20 Новости компании / Новости / Уведомление / Новости торговли

Professional BGA Substrate Manufacturer, Characteristic: ultra-small bump pitch, ultra-small trace and spacing. Mitsubishi BT base materials, ABF base materials, Rogers base materials. and other types materials. In today's rapidly developing field of electronic technology, Ball Grid Array (BGA) Substrate is an indispensable key circuit board component. Its unique design and…

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What is FCBGA Packaging?

2023-12-19 Новости компании / Новости / Уведомление / Новости торговли

Professional FCBGA Packaging Supplier, we mainly produce ultra-small bump pitch FCBGA Packaging substrate, ultra-small trace and spacing. Our company also offer FCBGA Packaging Service. In today's field of high-performance computers and communication equipment, FCBGA (Flip-Chip Ball Grid Array) Packaging technology is particularly important. As a PCB engineer with ten years…

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What is FCBGA Package?

2023-12-18 Новости компании / Новости / Уведомление / Новости торговли

FCBGA Package Firm. We offer FCBGA Package Substrates and we also produce the Package Substrates from 2 layer to 20 Слои. To use the ABF base or BT base and other types Package substrates base materials. FCBGA Package, or Fine-pitch Ball Grid Array Package, is an advanced and complex packaging…

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FCBGA Package Substrate| ABF Substrate Vendors

2023-12-15 Новости компании / Новости / Уведомление / Новости торговли

ABF Substrate Vendors. FCBGA Package Substrate were made with ABF(Ajinomoto) core materials. they are: GX92R,GXT31R2, GZ41R2H, GL102R8HF and others. or Showa Denko Series material. they are MCL-E-705G, MCL-E-770G, MECL-E-700G, MCL-E-795G and others. you also can use BT base. Rogers base and other types conventional material. FCBGA Package Substrate (Flip Chip Ball…

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ШЭНЬЧЖЭНЬ QYC CO., LTD

В основном мы производим 2-слойную и 20-слойную упаковочную подложку, Минимальная трасса 9 мкм, Минимальный интервал 9 мкм. Лучшие самые маленькие размеры VIA - 50 мкм. Минимальный размер Pithc Bomp составляет 100 мкм. и большинство материалов для подложек для упаковки мы использовали из Японии. Южная Корея.Качество материала основания очень стабильное.

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