Профессиональный производитель упаковочных подложек BGA.

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Package Substrate Prototype

2023-12-06 Новости компании / Новости / Уведомление / Новости торговли

Package Substrate Prototype. We use advanced Msap and Sap technology to build the Substrates and Package Prototype , High multilayer interconnection substrates from 2 Кому 20 Слои. Упаковка Субстрат, as we can surmise from its name, is a key electronic element. But what is it? On the big stage of…

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What is Flip Chip Packaging Substrate?

2023-12-05 Новости компании / Новости / Уведомление / Новости торговли

Flip Chip Packaging Substrate Manufacturers and Flip Chip Packaging prototypes up to mid-volume production. High speed material packaging substrate manufacturing. Advanced packaging production process. Flip Chip Packaging Substrate is an advanced integrated circuit packaging technology that is widely used in the field of microelectronic equipment manufacturing. This technology improves circuit…

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What is a substrate materials for optical packaging?

2023-12-04 Новости компании / Новости / Уведомление / Новости торговли

We are a professional Substrate materials for optical packaging. we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs. Substrate materials for optical packaging encompass the fundamental elements utilized in the production and integration of optical components. These materials play a pivotal role in determining…

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What is a substrate in packaging?

2023-12-01 Новости компании / Новости / Уведомление / Новости торговли

We are a professional Substrate in packaging, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs. Packaging substrates, as an integral part of modern electronic equipment, are key elements that connect, support and protect electronic components. In this high-tech era, we usually talk about…

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Flex-Rigid BGA Substrate

2023-11-30 Новости компании / Новости / Уведомление / Новости торговли

Flex-Rigid BGA Substrate Vender. We have made the Rigid-Flex BGA substrates. the BGA package substrate use the BT base and flex(PI) base.Advanced packaging substrate production process. Packaging substrates, as core components of electronic devices, play a key role in protecting and supporting electronic components. In this complex and critical area,…

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What is semiconductor packaging substrates?

2023-11-29 Новости компании / Новости / Уведомление / Новости торговли

Semiconductor packaging substrates fabrication. we mainly produce semiconductor substrate from 2 layer to 20 Слои, ultra-small trace and spacing packaging substrate. High speed and high frequency materials, or other types of low CTE materials. Semiconductor packaging substrates are a vital component of modern electronic devices. These substrates act as a…

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ШЭНЬЧЖЭНЬ QYC CO., LTD

В основном мы производим 2-слойную и 20-слойную упаковочную подложку, Минимальная трасса 9 мкм, Минимальный интервал 9 мкм. Лучшие самые маленькие размеры VIA - 50 мкм. Минимальный размер Pithc Bomp составляет 100 мкм. и большинство материалов для подложек для упаковки мы использовали из Японии. Южная Корея.Качество материала основания очень стабильное.

+86 0755 85241496

business@qycltd.com

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