Профессиональный производитель упаковочных подложек BGA.

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Package substrate materials introduction

2023-11-17 Новости компании / Новости / Уведомление / Новости торговли

Package substrate materials introduction and package substrate manufacture. You can use BT series core, High frequency series Core, high speed series Core materials. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 2 Кому 20 Слои. In the manufacturing of modern electronic devices, packaging substrates play a…

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What is Microtrace Package Substrates?

2023-11-16 Новости компании / Новости / Уведомление / Новости торговли

Microtrace Package Substrates Manufacturing, we mainly produce ultra-small bump pitch substrate with 100um, Microtrace and spacing packaging substrate with 9um to 30um. and from 30 to 80um gap substrates will be more easy manufacturing. In today's highly developed electronic field, 30 micron substrates play a vital role. This thin yet…

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More lower CTE Package Substrate Prototypes

2023-11-15 Новости компании / Новости / Уведомление / Новости торговли

More lower CTE Package Substrate Prototypes, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and HDI PCBs. Production of high multilayer packaging substrates with high speed and high frequency materials. The coefficient of thermal expansion (CTE) is a pivotal concept within the electronics industry, exerting…

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What is Substrate Layer Stackup?

2023-11-14 Новости компании / Новости / Уведомление / Новости торговли

Package substrate Supplier. We offer FCBGA package substrates from prototypes up to mid-volume production. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 Кому 18 Слои. Packaging substrates, as a key component of modern electronic equipment, play a vital role. It not only provides mechanical support…

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What is package substrate?

2023-11-13 Новости компании / Новости / Уведомление / Новости торговли

Professional Package substrate manufacturer, We offer Package substrate prototypes up to mid-volume production. we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and HDI PCBs. The packaging substrate, referred to as PCB (Printed Circuit Board), is a key electronic component, usually made of insulating materials with…

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What is semiconductor organic packaging substrates?

2023-11-10 Новости компании / Новости / Уведомление / Новости торговли

Semiconductor organic packaging substrates manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 2 Кому 20 Слои. In today's digital era, semiconductor technology has assumed an indispensable role in our daily lives. From smartphones to electric cars, nearly all electronic devices rely on semiconductor chips. To…

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ШЭНЬЧЖЭНЬ QYC CO., LTD

В основном мы производим 2-слойную и 20-слойную упаковочную подложку, Минимальная трасса 9 мкм, Минимальный интервал 9 мкм. Лучшие самые маленькие размеры VIA - 50 мкм. Минимальный размер Pithc Bomp составляет 100 мкм. и большинство материалов для подложек для упаковки мы использовали из Японии. Южная Корея.Качество материала основания очень стабильное.

+86 0755 85241496

business@qycltd.com

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