Профессиональный производитель упаковочных подложек BGA.

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What is Organic Packaging Chip Substrates?

2023-11-09 Новости компании / Новости / Уведомление / Новости торговли

Organic packaging substrates Supplier. Advanced organic packaging substrates from prototypes up to mid-volume production .We use advanced Showa Denko and Ajinomoto High speed material base materials, Produce High multilayer interconnection packaging substrates from 2 Кому 20 Слои. In the realm of modern electronics, Organic Substrate Packaging (OSP) stands out as…

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Ultra-small bump pitch substrate

2023-11-08 Новости компании / Новости / Уведомление / Новости торговли

Ultra-small bump pitch substrate manufacture, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and HDI PCBs. Packaging substrates, serving as the cornerstone of modern electronics, hold a position of paramount importance. Their significance extends beyond merely providing support and interconnections for various electronic components; it…

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Types of materials for high-speed packaging substrate

2023-11-08 Новости компании / Новости / Уведомление / Новости торговли

High speed package substrate supplier. Types of materials for high-speed packaging substrate. we have used the Showa Denko and Ajimomoto and BT base materials. or maybe Rogers high frequency materials. Within the realm of contemporary electronics, laminates emerge as an indispensable technology. Serving as a fundamental component in the domain…

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Top 10 IC Packaging Substrate Firm

2023-11-07 Новости компании / Новости / Уведомление / Новости торговли

IC Packaging Substrate Producer. the Package Substrate will be made with BT materials, Rogers materials, High TG FR4 Base, Showa Denko and Ajinomoto High speed materials. or other types high speed materials and high frequency materials. In the realm of modern electronics, the significance of IC packaging substrates cannot be…

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What is IC Package Substrate?

2023-11-07 Новости компании / Новости / Уведомление / Новости торговли

We are a professional IC package substrate producer, we mainly produce ultra-small trace and spacing IC packaging substrate and HDI PCBs. The material selection for flip chip package substrates holds significant importance. In flip chip packaging, various materials, such as organic substrates, ceramics, and silicon, are commonly utilized, each presenting…

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Embedded Wafer-Level Packaging Substrate

2023-11-06 Новости / Новости торговли

Embedded wafer-level-packages Substrate Firm, High-precision production technology, advanced equipment and professional team. we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and DHI PCBs. In today's electronic landscape, Embedded Wafer-Level Packaging (WLP) has emerged as a pivotal facet of packaging technology. This article aims to provide…

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ШЭНЬЧЖЭНЬ QYC CO., LTD

В основном мы производим 2-слойную и 20-слойную упаковочную подложку, Минимальная трасса 9 мкм, Минимальный интервал 9 мкм. Лучшие самые маленькие размеры VIA - 50 мкм. Минимальный размер Pithc Bomp составляет 100 мкм. и большинство материалов для подложек для упаковки мы использовали из Японии. Южная Корея.Качество материала основания очень стабильное.

+86 0755 85241496

business@qycltd.com

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