Профессиональный производитель упаковочных подложек BGA.

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Where to Buy the Package Substrate?

2023-11-06 Новости / Новости торговли

High-precision Package substrate manufacturer. We use advanced Msap and Sap technology to produce High multilayer interconnection substrates from 2 Кому 20 Слои. In modern electronic equipment, packaging substrate (Упаковка Субстрат) plays a vital role. It is the support and connection hub of electronic components and plays a key role. To…

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What is the Chip Package Substrate?

2023-11-03 Новости / Новости торговли

Chip Package Substrate Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um,and the smallest gap are 9um. most of the design are 15um to 30um trace and spacing. In the contemporary digital era, electronic devices have seamlessly woven themselves into every facet…

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What is BT Package Substrate?

2023-11-03 Новости компании / Новости / Уведомление / Новости торговли

BT package substrate Manufacture. We use advanced Msap and Sap technology to build High multilayer interconnection substrates from 2 Кому 20 Слои. The semiconductor industry has consistently maintained its position at the vanguard of rapid development and innovation, with semiconductor packaging substrates assuming a pivotal role in this trajectory. These…

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BGA Package Substrate Vender

2023-11-02 Новости / Новости торговли

BGA Package Substrate Vender, we build ultra-small bump pitch IC/BGA substrate from 2 layer to 20 Слои, ultra-small trace and spacing packaging substrate and smallest gap PCBs. At the forefront of modern technology, the electronics industry relies heavily on various essential components. Among these, packaging substrates and printed circuit boards…

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4-Layer Package Substrate

2023-11-02 Новости торговли

4 layer Package Substrate Manufacturing, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and microtrace HDI PCBs. FCBGA package and package substrate manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 Кому 18 Слои,The core of electronic devices is constantly…

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Package Substrate PCB Manufacturing

2023-11-01 Новости торговли

Package Substrate PCB Manufacturing. the Package Substrate will be made with BT Base materials, Rogers base materials, Showa Denko and Ajinomoto High speed materials.or other types high speed materials and high frequency materials.The sophistication and performance of electronic devices depend not only on the design of their internal circuits, but…

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ШЭНЬЧЖЭНЬ QYC CO., LTD

В основном мы производим 2-слойную и 20-слойную упаковочную подложку, Минимальная трасса 9 мкм, Минимальный интервал 9 мкм. Лучшие самые маленькие размеры VIA - 50 мкм. Минимальный размер Pithc Bomp составляет 100 мкм. и большинство материалов для подложек для упаковки мы использовали из Японии. Южная Корея.Качество материала основания очень стабильное.

+86 0755 85241496

business@qycltd.com

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