Профессиональный производитель упаковочных подложек BGA.

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How to build a Substrate Packaging?

2023-11-01 Новости торговли

We are a professional packaging substrate supplier, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs. At the heart of this expansive electronic universe lies packaging substrate technology. Although it often resides hidden within electronic devices, its significance is undeniable. Packaging substrate technology functions…

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Exploring Package Substrate Materials

2023-10-31 Новости компании / Новости / Уведомление / Новости торговли

We are Package Substrate Firm.Exploring Package Substrate Materials.Such as: Showa Dekno series: MCL-E705G, MCL-E-770G, Ajinomoto series: GX92R, GXT31R2, and so on. we are a professional package substrate maker. In today's digital age, electronic devices have become an indispensable part of our lives. Whether it is our smartphones, computers, or automotive…

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Package Substrate Design Rule

2023-10-31 Новости торговли

Package Substrate Design Rule. We are a professional packaging substrate supplier, about the substrate design details and process capabilities, if you have questions, you can feel free to contact us, we will help you understand the substrate production and process capabilities. Packaging substrate design, as a key component of modern…

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The key characteristics of FCBGA Packaging

2023-10-30 Новости торговли

FCBGA Packaging Supplier. and FCBGA Package Substrate Manufacturing. To use the Msap and Sap technology. we offer the FC BGA Packaing and substrate service. High frequency and high speed materials are used to manufacture the packaging substrates from 2layer to 18 Слои. In modern electronic manufacturing, FCBGA Packaging (ball grid…

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What is FCBGA Packaging Substrate?

2023-10-30 Новости торговли

FCBGA Packaging Substrate Manufacturer. Advanced production process and high-precision production equipment can produce 2 Кому 20 layers of substrate. in today's electronic manufacturing field, FCBGA Packaging Substrate plays a vital role. This section will introduce the importance of FCBGA Packaging Substrate in modern electronic manufacturing, and the topics that will…

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Showa Denko/Ajinomoto Packaging Substrate

2023-10-27 Новости торговли

Showa Denko/Ajinomoto Packaging Substrate Manufacturer. Showa Denko and Ajinomoto packaging substrate material design rules. Advanced ABF packaging substrate manufacturer. Design rules for packaging substrates are an important part of the semiconductor manufacturing and electronic packaging fields. They are a set of guidelines developed to ensure that packaging substrates are designed…

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ШЭНЬЧЖЭНЬ QYC CO., LTD

В основном мы производим 2-слойную и 20-слойную упаковочную подложку, Минимальная трасса 9 мкм, Минимальный интервал 9 мкм. Лучшие самые маленькие размеры VIA - 50 мкм. Минимальный размер Pithc Bomp составляет 100 мкм. и большинство материалов для подложек для упаковки мы использовали из Японии. Южная Корея.Качество материала основания очень стабильное.

+86 0755 85241496

business@qycltd.com

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