Профессиональный производитель упаковочных подложек BGA.

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Rogers Circuit Board Manufacturer

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Ultra-thin RF/Microwave PCB Manufacture

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Ultra-Multilayer FC-LGA Substrates Manufacturer

2024-06-26 Новости компании / Новости / Уведомление / Новости торговли

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ШЭНЬЧЖЭНЬ QYC CO., LTD

В основном мы производим 2-слойную и 20-слойную упаковочную подложку, Минимальная трасса 9 мкм, Минимальный интервал 9 мкм. Лучшие самые маленькие размеры VIA - 50 мкм. Минимальный размер Pithc Bomp составляет 100 мкм. и большинство материалов для подложек для упаковки мы использовали из Японии. Южная Корея.Качество материала основания очень стабильное.

+86 0755 85241496

business@qycltd.com

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