Профессиональный производитель упаковочных подложек BGA.

Тель:+086 0755 85241496 |

TradeNews-Page7of307-ProfessionalFlip-ChipPackagingSubstrateSupplier-Page7

Новости торговли

Дом

Новости торговли

Ultra-thin 5G Substrate Manufacturer

2024-06-25 Новости компании / Новости / Уведомление / Новости торговли

Ultra-thin 5G Substrate Manufacturer.As a leading ultra-thin 5G substrate manufacturer, we specialize in producing cutting-edge substrates essential for the next generation of high-speed communication. Our advanced manufacturing processes ensure superior performance, enabling seamless connectivity and miniaturization in 5G devices. We are committed to innovation and quality, meeting the growing demands…

Подробнее
Semiconductor Glass Substrate Manufacturer

2024-06-24 Новости компании / Новости / Уведомление / Новости торговли

Semiconductor Glass Substrate Manufacturer."Semiconductor Glass Substrate Manufacturer specializes in producing high-quality glass substrates tailored for semiconductor applications. Our advanced manufacturing processes ensure precise specifications, optimal performance, and reliability for cutting-edge semiconductor technologies." Semiconductor glass substrates are a specialized type of substrate used in various semiconductor applications. These substrates are made…

Подробнее
Flip Chip BGA Substrate Manufacturer

2024-06-23 Новости компании / Новости / Уведомление / Новости торговли

Flip Chip BGA Substrate Manufacturer."Flip Chip BGA Substrate Manufacturer" refers to a company specializing in the production of substrates designed for Ball Grid Array (BGA) packaging using flip chip technology. They excel in creating advanced interconnection solutions that enhance performance and reliability in modern electronic devices. Flip Chip BGA (Ball…

Подробнее
Ultra-Multilayer BGA Substrates Manufacturer

2024-06-22 Новости компании / Новости / Уведомление / Новости торговли

Ultra-Multilayer BGA Substrates Manufacturer."Ultra-Multilayer BGA Substrates Manufacturer" refers to a company specialized in producing advanced BGA substrates with multiple layers, catering to high-density interconnection needs in modern electronic devices. Ultra-multilayer BGA (Ball Grid Array) substrates are at the forefront of electronic packaging technology, driving advancements in high-performance computing, telecommunications, and…

Подробнее
RT Duroid 5880 Substrate Manufacturer

2024-06-21 Новости компании / Новости / Уведомление / Новости торговли

RT Duroid 5880 Substrate Manufacturer."RT Duroid 5880 Substrate Manufacturer" refers to a company specializing in the production of RT Duroid 5880 substrates, known for their high-frequency performance and reliability in electronic applications. What is RT Duroid 5880 Субстрат? RT Duroid 5880 substrate is a material specifically designed for high-performance circuit…

Подробнее
Microtrace Antenna Circuit Board Manufacturer

2024-06-20 Новости компании / Новости / Уведомление / Новости торговли

Microtrace Antenna Circuit Board Manufacturer.Microtrace Antenna Circuit Board Manufacturer specializes in producing advanced antenna circuit boards with precise microtraces, catering to diverse wireless communication needs. With the rapid development of wireless communication technology, Microtrace Antenna Circuit Board has become increasingly important as an indispensable key component in electronic equipment. This…

Подробнее

ШЭНЬЧЖЭНЬ QYC CO., LTD

В основном мы производим 2-слойную и 20-слойную упаковочную подложку, Минимальная трасса 9 мкм, Минимальный интервал 9 мкм. Лучшие самые маленькие размеры VIA - 50 мкм. Минимальный размер Pithc Bomp составляет 100 мкм. и большинство материалов для подложек для упаковки мы использовали из Японии. Южная Корея.Качество материала основания очень стабильное.

+86 0755 85241496

business@qycltd.com

Узнать цену ?