Professional BGA Packaging Substrate Manufacturer.


 high-density packaging substrates

 high-density packaging substrates

Currently, our company can produce various high-density packaging substrates ranging from 4 layers to 18 layers. We offer a wide range of substrate materials designed for small pitch packaging or circuit boards. The minimum Bump pitch is 100um, and the minimum trace and spacing can go as low as 9um/9um. Most of our customers typically use trace and spacing in the range of 20um to 30um. It’s important to note that as the number of layers increases and the trace and spacing become smaller, our production costs also increase. Conversely, larger trace and spacing with lower layer counts can reduce production costs.

When you are in the process of designing your original files, if you have any doubts or questions about the design details, please don’t hesitate to contact us. We offer free assistance to ensure that your design meets manufacturing requirements.

Since all complete design data is currently in a confidential stage, we are unable to fully disclose specific design and production references. However, we can provide some key data and information to help you better understand our manufacturing capabilities and services

If you need further information or have specific design requirements, please feel free to get in touch with us. We will do our utmost to provide excellent packaging substrate solutions tailored to your needs. We look forward to collaborating with you to achieve your project goals.

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