Fabricante profissional de substrato de embalagem BGA.

Tel:+086 0755 85241496 |

Fornecedor profissional de substrato de embalagem Flip-Chip

Menu

Casa
Produtos
Notícia
TECNOLOGIA
Contato
- Inquérito

Procurar

GetaQuote-ProfessionalFlip-ChipPackagingSubstrateSupplier

Obter uma tarifa

Casa

Obter uma tarifa

Obter uma tarifa

Δ

Share:

About Company

ABOUT US

SHENZHEN QYC CO.,LTD

We mainly produce 2-layer to 20-layer packaging substrate, minimum trace 9um, minimum spacing 9um. the best smallest via size are 50um. The Min Bomp Pithc are 100um. and most of the packaging substrate materials we used from Japan. South Korea.The material quality of the substrate is very stable.

QUICK LINKS

PRODUCTS

Flip-Chip Package Substrate

Package Substrate

FCBGA Packaging Substrate

Semiconductor packaging substrate

Ceramic packaging substrate

Cavity packaging substrate

PGA Package Substrate

SOP Package Substrate

SIP Package Substrate

CONTACT US

Phone: +86 0755 85241496

E-mail: business@qycltd.com

Skype: Henrychinasz

WhatsAPP: +8615014077679

Address: Oriental Business Building, 182 Baomin 2nd Road, Xixiang Street, Baoan District, Shenzhen, Guangdong,China

Copyright © 2022 SHENZHEN QYC CO.,LTD All Rights Reserved.

+86 0755 85241496

business@qycltd.com

Get a Quote ?

Δ